Generally LEDs are mounted in the package that provides two electrical leads, a transparent optical window for the emission and heat-sinking. An LED chip is soldered/glued to the package surface that is connected to the one of the lead wires. Top contact of the chip is connected to the other lead with a bonding wire.
We offer a range of standard and customized TO- and SMD-type packages:
TO-18
Appropriate for mounting one-element LEDs, single-wavelength matrices, 2-wavelength matrices
![](https://www.eoc-inc.com/wp-content/uploads/LED Microsensor/TO-18 cap_window.png)
TO-18 with cap
with glass window
Datasheet
![](https://www.eoc-inc.com/wp-content/uploads/LED Microsensor/TO18 _cap.png)
TO-18 with cap
without window
Datasheet
![](https://www.eoc-inc.com/wp-content/uploads/LED Microsensor/TO18_RW.png)
TO-18 with parabolic reflector
with quartz/sapphire window
Datasheet
![](https://www.eoc-inc.com/wp-content/uploads/LED Microsensor/To-18R.png)
TO-18 with parabolic reflector
without window
Datasheet
TO5 (TO39)
Appropriate for mounting one element LEDs or LED-matrices
![](https://www.eoc-inc.com/wp-content/uploads/LED Microsensor/TO5PD_TEMcw.png)
TO-5 with built-in TEM covered by cap with quartz/sapphire window
Datasheet
![](https://www.eoc-inc.com/wp-content/uploads/LED Microsensor/TO5_tem_PRW.png)
TO-5 with built-in TEM covered by parabolic reflector with quartz/sapphire window
Datasheet
TO8
Appropriate for mounting multi-element LED-matrices
SMD type packages